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Mainboard|GIGABYTE|Intel B760 Express|LGA1700|ATX|Memory DDR5|Memory slots 4|4xPCI-Express 3.0 1x|1xPCI-Express 4.0 16x|2xM.2|1xHDMI|1xDisplayPort|4xUSB 2.0|1xUSB 3.2|1xUSB-C|1xPS/2|1xRJ45|3xAudio port|B760DS3H

149,81 €

Noliktavā: 13 gab.

Noliktavā: 13 gab.

SKU: 1392916 Kategorijas: Mātesplates priekš INTEL CPU

Dalīties

Specifikācija/Parametri

Garantija (mēneši): 36

Ražotājs: GIGABYTE

Ražotāja kods: B760DS3H

Svars: 1.28 kg

Model: B760 DS3H

Chipset: Intel B760 Express

Socket: LGA1700

Form Factor: ATX

Memory type: DDR5

Frequency speed: 4000/4800/5200/5400/5600/5800/6000/6200/6400/6600/6800/7000/7200/7400/7600 MHz

Memory slots: 4

Integrated video: Depending on CPU

Integrated LAN: Gigabit

Integrated audio: Yes

RAID: SATA 0, 1, 5, 10

TPM: Header

Shipping box quantity: 1

Unit Brutto Volume: 0.007344 cubm

Unit Net Weight: 0.9 kg

Unit Box Width: 0.27

Unit Box Length: 0.34

Unit Box Height: 0.08

Expansion slots

PCI-Express 4.0 16x: 1

PCI-Express 3.0 1x: 4

M.2: 2

Input/Output connectors

Audio port: 3

DisplayPort: 1

HDMI: 1

PS/2: 1

RJ45: 1

USB 2.0: 4

USB 3.2: 1

USB-C: 1

Interface

USB 3.2: Yes

SATA: Yes

USB 2.0: Yes

Shipping/Package Box Dimensions

Shipping Box Width: 27 cm

Shipping Box Weight: 1.277 kg

Shipping Box Height: 8 cm

Shipping Box Depth: 34 cm

Ražotāja mājaslapa: www.gigabyte.com/Motherboard/B760-DS3H-rev-10

Apraksts

– Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
– Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution
– Dual Channel DDR5:4*DIMMs XMP Memory Module Support
– Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
– EZ-Latch:PCIe 4.0×16 Slot with Quick Release Design
– Fast Networks:GbE LAN
– Extended Connectivity:Rear USB-C® 20Gb/s, DP, HDMI
– Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
– Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card

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